Method of manufacturing a ball grid array substrate or a semiconductor chip package

ABSTRACT

A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a U.S. divisional application filed under 37 CFR1.53(b) claiming priority benefit of U.S. Ser. No. 12/923,037 filed inthe United States on Aug. 30, 2010, now allowed, which claims earlierforeign priority benefit to Korean Patent Application No.10-2009-0102733 filed with the Korean Intellectual Property Office onOct. 28, 2009, the disclosures of which are incorporated herein byreference.

BACKGROUND

1. Field

The present invention relates to a ball grid array substrate, asemiconductor chip package and a method of manufacturing the same, andmore particularly, to a ball grid array substrate having an ultra-thinprofile and including a high-density circuit pattern, a semiconductorchip package, and a method of manufacturing the same.

2. Description of the Related Art

The recent trend of the electronic industry is to manufacture small,light-weight, multi-functional, high-performance and high-reliabilityproducts at low cost. One of important technologies, enabling therealization of such products, is a packaging technology. In this regard,a Chip Scale Package (CSP) has recently been developed. The CSP providesa semiconductor device package miniaturized to a semiconductor chipscale, and has a size of less than about 1.2 times greater than a chipsize.

Furthermore, the rapid advancement in the performance of a semiconductorchip requires a packaging substrate to be improved accordingly. Thedemand for a packaging substrate achieving higher density, higher speedand smaller size is increasing. Moreover, a packaging substrate,allowing for an even system in packaging, is currently in demand.

A flip-chip ball grid array substrate, used as this packaging substrate,is faced with issues such as advanced electric properties, highreliability, a high-speed signal transfer structure, an ultra-thinprofile and fine circuit patterns according to the specifications of asemiconductor device.

For example, the technical trend for a flip-chip ball grid arraysubstrate in 2007 suggested that an L/S (Line/Space) representing thecritical dimension of a circuit pattern and the interval between circuitpatterns be 10 □/10 □, and the thickness of the flip-chip ball gridarray substrate be 0.2 mm.

However, the related art flip-chip ball grid array substrate adopts athick copper clad laminate as a core, which results in an increase inthe overall thickness of the flip-chip ball grid array substrate.Consequently, it is difficult to manufacture the flip-chip ball gridarray substrate as an ultra-thin plate of 0.2 mm or less.

SUMMARY

An aspect of the present invention provides a ball grid array substratehaving an ultra-thin profile and including a high-density circuitpattern, a semiconductor chip package, and a method of manufacturing thesame.

According to an aspect of the present invention, there is provided aball grid array substrate including: an insulating layer having a firstsurface providing a mounting region for a semiconductor chip, a secondsurface opposing the first surface, and an opening connecting the secondsurface with the mounting region of the semiconductor chip; and acircuit pattern buried in the second surface.

The insulating layer may include resin and a reinforcement matrix.

The circuit pattern may include a wire bonding pad and a ball pad.

According to another aspect of the present invention, there is provideda semiconductor chip package including: an insulating layer including afirst surface providing a mounting region for a semiconductor chip, asecond surface opposing the first surface, and an opening connecting thesecond surface with the mounting region of the semiconductor chip; acircuit pattern buried in the second surface; a semiconductor chipincluding at least one bonding pad formed on an active surface, andmounted on the first surface such that the bonding pad is exposedthrough the opening; and a bonding wire connecting the circuit patternwith the bonding pad.

The circuit pattern may include a wire bonding pad and a ball pad.

A solder ball may be formed on the circuit pattern.

According to another aspect of the present invention, there is provideda method of manufacturing a ball grid array substrate, the methodincluding: forming a first circuit pattern and a second circuit patternon a first metal carrier and a second metal carrier, respectively;stacking a first insulating layer and a second insulating layer with aseparable material interposed therebetween, wherein each of the firstinsulating layer and the second insulating layer has first and secondsurfaces opposing each other, and the first surface contacts theseparable material; burying the first and second circuit patterns in thesecond surfaces of the first and second insulating layers, respectively;removing the first and second metal carriers; removing the separablematerial to separate the first and second insulating layers from eachother; and forming an opening in each of the first and second insulatinglayers to connect the first and second surfaces with each other.

The separable material may be removed by ultraviolet light or heat.

The circuit pattern may include a wire bonding pad and a ball pad.

According to another aspect of the present invention, there is provideda method of manufacturing a semiconductor chip package, the methodincluding: forming a first circuit pattern and a second circuit patternon a first metal carrier and a second metal carrier, respectively;stacking a first insulating layer and a second insulating layer with aseparable material interposed therebetween, wherein each of the firstand second insulating layers has first and second surfaces opposing eachother, and the first surface contacts the separable material; buryingthe first and second circuit patterns in the second surfaces of thefirst and second insulating layers, respectively; removing the first andsecond metal carriers; removing the separable material to separate thefirst and second insulating layers from each other; forming an openingin each of the first and second insulating layers to connect the firstsurface with the second surface; mounting a semiconductor chip,including at least one bonding pad formed on an active surface, on thefirst surface, such that the bonding pad is exposed through the opening;and connecting the circuit pattern with the bonding pad by using abonding wire.

The separable material may be removed by ultraviolet light or heat.

The circuit pattern may include a wire bonding pad and a ball pad.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1A is a schematic plan view illustrating a ball grid arraysubstrate according to an exemplary embodiment of the present invention;

FIG. 1B is a cross-sectional view taken along line A-A′ of FIG. 1,illustrating a part of the ball grid array substrate;

FIG. 2A is a schematic plan view illustrating a semiconductor chippackage according to an exemplary embodiment of the present invention;

FIG. 2B is a schematic cross-sectional view illustrating a semiconductorchip package according to an exemplary embodiment of the presentinvention;

FIGS. 3A through 3G are cross-sectional views illustrating a method ofmanufacturing a ball grid array substrate according to an exemplaryembodiment of the present invention; and

FIGS. 4A through 4C are cross-sectional views illustrating a method ofmanufacturing a semiconductor chip package according to an exemplaryembodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

Exemplary embodiments of the present invention will now be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the shapes and dimensions ofelements are exaggerated for clarity. The same or equivalent elementsare referred to by the same reference numerals throughout thespecification.

FIG. 1A is a schematic plan view illustrating a ball grid arraysubstrate according to an exemplary embodiment of the present invention.FIG. 1B is a cross-sectional view taken along line A-A′ of FIG. 1A,illustrating a part of the ball grid array substrate.

Referring to FIGS. 1A and 1B, a ball grid array substrate 100, accordingto this exemplary embodiment, includes a first surface 111 providing amounting region for a semiconductor chip, a second surface 112 opposingthe first surface 111, an insulating layer having an opening 113connecting the second surface with the mounting region for thesemiconductor chip, and a circuit pattern 20 buried in the secondsurface 112.

The insulating layer 110, although not limited thereto, may utilize aresin material impregnated with a reinforcement matrix. For example, theinsulating layer 110 may be formed of half-hardened prepreg.

The resin, although not limited thereto, may utilize, for example, epoxyresin, polyimide or Bismaleimide Triazine (BT) resin or the like. Thereinforcement matrix, although not limited thereto, may utilize glassfiber aramid, paper or the like.

The circuit pattern 120 is buried in the second surface 112 of theinsulating layer 110, and includes wire bonding pads 121 connected witha bonding wire, and ball pads 122 on which a solder balls are formed.

A solder resist layer, although not illustrated thereupon, may be formedon the circuit pattern 120.

FIG. 2A is a schematic plan view illustrating a semiconductor chippackage according to an exemplary embodiment of the present invention.FIG. 2B is a schematic cross-sectional view illustrating a semiconductorchip package according to an exemplary embodiment of the presentinvention.

Referring to FIGS. 2A and 2B, the semiconductor chip package, accordingto this exemplary embodiment, includes a ball grid array substrate and asemiconductor chip mounted on the ball grid array substrate.

The semiconductor chip package, according to this exemplary embodiment,is a Board On Chip package.

The ball grid array substrate includes the first surface 111 providing amounting region for a semiconductor chip, the second surface 112opposing the first surface 111, the insulating layer 110 having anopening 113 connecting the first surface 111 with the second surface112, and the circuit pattern 120 buried in the second surface.

A semiconductor chip 200 is mounted with its face down on the firstsurface 111 of the ball grid array substrate. Thus, an active surface201 of the semiconductor chip 200 faces the ball grid array substrate,and is partially exposed through the opening 113.

Electronic devices and circuits are formed on the active surface 201,and at least one bonding pad 210 is formed on the active surface 201.The bonding pad 210 is exposed through the opening 113 of the ball gridarray substrate.

The semiconductor chip 200 is connected to the circuit pattern 120 ofthe ball grid array substrate by a bonding wire 220. The bonding wire220 bonds the bonding pad 210 of the semiconductor chip 200, exposedthrough the opening 113, to the circuit pattern 121 of the ball gridarray substrate, thereby providing an electronic connectiontherebetween.

The semiconductor chip package may include an encapsulant 230surrounding the bonding wire 220 and filling up the opening 113.

The encapsulant 230 may be formed by dispensing, potting, printing,molding or the like.

The encapsulant 230 may utilize a material capable of protecting asubsequent process and the bonding wire of the semiconductor chippackage. The encapsulant 230, although not limited thereto, may utilizeepoxy, silicon or the like, for example.

Furthermore, a solder ball 123 may be formed on the ball pad 122 of theball grid array substrate.

The solder ball 123 provides a connection between the ball grid arraysubstrate with an external circuit such as a system board or the like.

Hereinafter, a method of manufacturing a ball grid array substrate,according to an exemplary embodiment of the present invention, will bedescribed.

FIGS. 3A through 3G are cross-sectional views illustrating a method ofmanufacturing a ball grid array substrate according to an exemplaryembodiment of the present invention.

First, circuit patterns are formed on a first metal carrier 130 a and asecond metal carrier 130 b.

Here, the first and second metal carriers 130 a and 130 b may be formedof copper and each have a thickness of 12□ or greater.

A method of forming a circuit pattern is not limited to a specificmanner, and may adopt a method which is generally used in this technicalfield.

For example, as shown in FIG. 3A, a plating resist layer 140, havingopenings corresponding to a circuit pattern, is formed on the firstmetal carrier 130 a, and is subjected to exposure, development andelectroplating. Before the electroplating process, a seed layer may beformed by electroless plating, and a circuit pattern may be then formedthereon through electroplating. In such a manner, a circuit pattern 120corresponding to the openings h of the plating resist layer 140 isformed as shown in FIG. 3B.

The circuit pattern 120 may include wire bonding pads 121 and ball pads122.

The first metal carrier 130 a and the second metal carrier 130 b may besubjected to the same processes. Therefore, a description is made mainlyabout the first metal carrier 130 a.

Thereafter, as shown in FIG. 3C, a first insulating layer 110 a and asecond insulating layer 110 b are stacked with a separable material 150interposed therebetween. The first insulating layer 110 a and the secondinsulating layer 110 b each have a first surface 111 and a secondsurface 112 opposing each other. The first and second insulating layers110 a and 110 b are stacked such that the first surfaces 111 thereofcontact the separable material 150.

Subsequently, the circuit pattern 120 formed on the first metal carrier130 a is disposed to face the second surface of the first insulatinglayer 110 a, and the circuit pattern formed on the second metal carrier130 b faces the second surface of the second insulating layer 110 b. Thefirst and second insulating layers 110 a and 110 b may be formed ofhalf-hardened prepreg of resin impregnated with a reinforcement matrix.

Thereafter, as illustrated in FIG. 3D, the first and second insulatinglayers 110 a and 110 b are compressed so that the circuit patterns(hereinafter also “first and second circuit patterns”) of the first andsecond metal carriers 130 a and 130 b are buried in the first insulatinglayer 110 a and the second insulating layer 110 b, respectively.

Thereafter, as shown in FIG. 3E, the first metal carrier 130 a and thesecond metal carrier 130 b are removed. The removal of the first andsecond metal carriers 130 a and 130 b, although not limited thereto, maybe performed by a chemical method using etching.

Although not shown, a solder resist layer may be formed on the firstcircuit pattern 120 a and the second circuit pattern 120 b.

As shown in FIG. 3F, the separable material 150 is removed to therebyseparate the first insulating layer 110 a from the second insulatinglayer 110 b.

The separable material 150 may utilize a material that has an adhesiveforce weakened by a predetermined factor. The predetermined factor maybe ultraviolet light, heat or the like. The separable material 150,bonded to the first and second insulating layers 110 a and 110 b, may beeasily separated as its adhesive force is weakened by a predeterminedfactor.

Thereafter, as shown in FIG. 3G, an opening 113 connecting the first andsecond surfaces 111 and 112 of the first insulating layer 110 a isformed.

The forming of the opening 113 may be performed by a laser drillingprocess or a CNC drilling process; however, it is not limited thereto.

The method of manufacturing the ball grid array substrate, according tothis exemplary embodiment, is performed by stacking two insulatinglayers. Therefore, a predetermined level of thickness or higher isensured thereby allowing for the use of existing devices and theproduction of an ultra-thin substrate. Furthermore, two ball grid arraysubstrates are manufactured through a single process, thereby shorteningthe manufacturing process.

Furthermore, since a circuit pattern is formed on a metal carrier andburied in an insulating layer, a high-density circuit pattern may beformed.

FIGS. 4A through 4C are cross-sectional views illustrating a method ofmanufacturing a semiconductor chip package according to an exemplaryembodiment of the present invention.

Hereinafter, a method of manufacturing a semiconductor chip packageaccording to an exemplary embodiment of the present invention will bedescribed with reference to FIGS. 4A through 4C.

Since the ball grid array substrate, used for the semiconductor chippackage, is manufactured in the same manner as in the above-describedembodiment, the following description will be made with regard toprocesses after the manufacturing process described with reference toFIG. 3G.

As shown in FIG. 4A, a semiconductor chip 200 is mounted on the firstsurface 111 of the ball grid array substrate. The semiconductor chip 200is mounted with its face down on the ball grid array substrate. That is,an active surface 201 of the semiconductor chip faces the substrate, andis partially exposed through the opening 113. Here, the semiconductorchip 200 is mounted such that the bonding pad 210 on the active surface201 is exposed through the opening 113 of the ball grid array substrate.

Thereafter, as shown in FIG. 4B, the bonding pad 201 of thesemiconductor chip 200 is connected with the circuit pattern 120 of theball grid array substrate by using a bonding wire 220. Accordingly, thebonding pad 201 of the semiconductor chip 200, exposed through theopening 113, is electrically connected with the circuit pattern 121 ofthe ball grid array substrate.

Subsequently, as shown in FIG. 4C, the opening 113 is filled with anencapsulant 230 to surround the bonding wire 220. The encapsulant 230may be formed by dispensing, potting, printing, molding or the like.

Furthermore, a solder ball 123 is formed on the ball pad 122 of the ballgird array substrate. The solder ball 123 may connect the ball gridarray substrate with an external circuit such as a system board or thelike.

As set forth above, according to exemplary embodiments of the invention,ball grid array substrates are manufactured by stacking two insulatinglayers. Accordingly, a sufficient level of thickness is ensured, whichallows for the use of existing devices and the production of ultra-thinsubstrates. Since two ball grid array substrates are manufacturedthrough a single process, thereby shortening the manufacturing process.Furthermore, a circuit pattern is buried in the insulating layer,thereby achieving the formation of a high-density circuit pattern.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

What is claimed is:
 1. A method of manufacturing a ball grid arraysubstrate, the method comprising: forming a first circuit pattern and asecond circuit pattern on a first metal carrier and a second metalcarrier, respectively; stacking a first insulating layer and a secondinsulating layer with a separable material interposed therebetween,wherein each of the first insulating layer and the second insulatinglayer has first and second surfaces opposing each other, and the firstsurface contacts the separable material; burying the first and secondcircuit patterns in the second surfaces of the first and secondinsulating layers, respectively; removing the first and second metalcarriers; removing the separable material to separate the first andsecond insulating layers from each other; and forming an opening in eachof the first and second insulating layers to connect the first andsecond surfaces with each other.
 2. The method of claim 1, wherein theseparable material is removed by ultraviolet light or heat.
 3. Themethod of claim 1, wherein the circuit pattern comprises a wire bondingpad and a ball pad.
 4. A method of manufacturing a semiconductor chippackage, the method comprising: forming a first circuit pattern and asecond circuit pattern on a first metal carrier and a second metalcarrier, respectively; stacking a first insulating layer and a secondinsulating layer with a separable material interposed therebetween,wherein each of the first and second insulating layers has first andsecond surfaces opposing each other, and the first surface contacts theseparable material; burying the first and second circuit patterns in thesecond surfaces of the first and second insulating layers, respectively;removing the first and second metal carriers; removing the separablematerial to separate the first and second insulating layers from eachother; forming an opening in each of the first and second insulatinglayers to connect the first surface with the second surface; mounting asemiconductor chip, comprising at least one bonding pad formed on anactive surface, on the first surface, such that the bonding pad isexposed through the opening; and connecting the circuit pattern with thebonding pad by using a bonding wire.
 5. The method of claim 4, whereinthe separable material is removed by ultraviolet light or heat.
 6. Themethod of claim 4, wherein the circuit pattern comprises a wire bondingpad and a ball pad.